IT-258GA3
IT-258GA3
IT-258GA3是一种mid Tg (155℃ by DSC)无卤多功能填充环氧树酯,具有低CTE、高热可靠性及耐CAF特性,适合用于260℃无铅製程汽车方面应用。
应用
汽车(引擎室电子控制元件)
多层板和HDI板
厚铜板
重要特性
Advanced halogen free resin system
Low CTE
High heat resistance
Excellent CAF resistance (1000 Volts)
Good through-hole reliability
High Comparative Tracking Index (CTI) and thermal conductivity
性能
| Items | Methods | IT-258GA3 |
| Tg (℃) | DSC | 155 |
| T-288 (w/ 1oz Cu, min) | TMA | >60 |
| Td-5%(℃) | TGA 5% loss | 385 |
| CTE (ppm/℃) | a1/a2 | 35/210 |
| CTE (%), 50-260℃ | TMA | 2.8 |
| Dk @ 10 GHz (RC 50%) | IPC TM-650 2.5.5.13 | 4.3 |
| Df @ 10 GHz (RC 50%) | IPC TM-650 2.5.5.13 | 0.016 |
| CTI (Volts) | EC 60112 / UL 746 | CTI1(400-599) |
| Thermal Conductivity (W/mK) | ASTM D5470 | 0.7 |
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IT-158
IT-158
IT-158是一种mid-Tg (155℃by DSC)多功能填充环氧树酯,具有高热可靠性及耐CAF特性,适合各种应用及可通过于260℃无铅製程。
应用
汽车(引擎室电子控制元件)
多层板和HDI电路板
桌机和笔电
记忆体模组
游戏机
伺服器和网路连结
电信
厚铜板
重要特性
Low CTE
High heat resistance
Excellent CAF resistance
Good through-hole reliability
性能
| Items | Methods | IT-158 |
| Tg (℃) | DSC | 155 |
| T-288 (w/ 1oz Cu, min) | TMA | 20 |
| Td-5%(℃) | TGA 5% loss | 345 |
| CTE (ppm/℃) | a1/a2 | 40/240 |
| CTE (%), 50-260℃ | TMA | 3.3 |
| Dk @ 10 GHz (RC 50%) | IPC TM-650 2.5.5.13 | 4.0 |
| Df @ 10 GHz (RC 50%) | IPC TM-650 2.5.5.13 | 0.018 |
