I、 2025 Business Results

（I）Business Plan Implementation Results

Unit: NT$ thousand

（II）Performance of Operating Budget
The Corporation did not make its forecast for 2025 public, so it is unnecessary to disclose the operating budget performance. However, the overall actual operating conditions and performance generally align with the Corporation’s internal operating plan.
（III）Analysis of Financial Income and Expenditure and Profitability

（IV）Research Development Status

1. AI Computing and Infrastructure Materials R&D
   Leveraging the explosive growth of generative AI and the global trend toward net-zero emissions, ITEQ places “innovation” and “sustainability” at the core of its R&D, proactively positioning itself in advanced AI electronic materials. In response to the rapid doubling of AI server computing power, the demand for 800G/1.6T high-speed switches, and PCIe Gen6/Gen7 ultra-high-speed transmission, ITEQ provides solutions with ultra-low loss and superior signal integrity. To address the processing challenges of high layer count (HLC) boards under high-computing architectures, ITEQ has successfully developed a range of materials featuring low dielectric properties and low coefficient of thermal expansion (low CTE). These materials effectively ensure dimensional stability and mitigate warpage under high-temperature soldering conditions, thereby enhancing transmission reliability in high-density interconnect designs. Meanwhile, through close collaboration with leading global customers, ITEQ is proactively expanding into edge computing, 6G communications, and smart automotive applications, ensuring it remains at the forefront of next-generation high-speed computing architectures.
2. Key Process Technologies and Diverse Application Fields
   In terms of technological innovation, the Company has successfully developed key PCB materials, including Low Loss Interlayer Bonding Film (Low Loss IBF) and Resin-Coated Copper (RCC). Through its proprietary low-dielectric resin coating process, the Company achieves product miniaturization, ultra-low loss, and high thermal conductivity, precisely meeting future demands for high-speed, low-latency, and high-density circuit design. In addition, its strategic R&D achievements across various application fields are as follows:
   • Consumer Electronics: Driven by AI technologies, the Company has introduced high-frequency, high-speed, and ultra-thin flexible laminates for AI smartphones, AI PCs (AIPC), and wearable devices (such as AI glasses), meeting the needs for device miniaturization and low-loss, high-speed signal transmission.
   • Automotive Electronics: In response to trends in vehicle electrification and intelligentization, the Company has mass-produced highly reliable products with resistance to conductive anodic filament (CAF) and high glass transition temperature (High Tg), supporting demanding applications such as power battery advancements, autonomous driving (ADAS), and smart cockpits.
   • Emerging Technologies: The Company is actively expanding into fields such as humanoid robotics, the low-altitude economy (e.g., drones), and biomedical engineering. It has also optimized flexible materials with specialized thickness specifications to build a diversified product portfolio, strengthening its competitive advantages and market moat.
3. Green R&D and Sustainable Development
   ITEQ integrates ESG principles into the core of its operations, building a resilient governance framework. Its R&D direction aligns with the 2050 net-zero emissions target, and AI systems have been introduced to enhance R&D efficiency and production energy efficiency. At the same time, the Company collaborates closely with supply chain partners to develop low-carbon raw materials and optimize the carbon footprint across the entire product lifecycle. Through environmentally friendly processes and green technologies, ITEQ fulfills its corporate social responsibility and contributes steady momentum toward smart living and a sustainable future.

II、Summary of 2025 Business Plan

（I）Management Principles

1. Focusing on Advanced Electronic Materials and Continuously Expanding Application Domain
   As global demand for advanced electronic materials continues to grow steadily-particularly in key sectors such as AI servers, high-speed computing, low Earth orbit (LEO) satellites, electric vehicles (EVs), and data centers-related applications are rapidly expanding. Our company continues to deepen its technological development, focusing on high-frequency, low-loss materials, as well as materials with high thermal resistance and reliability, while also promoting environmentally friendly electronic-grade copper clad laminate (CCL) materials. At the same time, we are expanding our global market share and strengthening partnerships with leading international companies to reinforce our core competitiveness and enhance our industry presence.
2. Strengthening Supply Chain Management to Ensure Quality and Stable Supply
   Supply chain resilience has become a cornerstone of industrial competitiveness. Our company will further enhance supply chain quality management by overseeing raw material suppliers, controlling processes, and verifying products, all while adhering to testing standards and ensuring compliance with international regulations and customer requirements. Concurrently, we will introduce smart manufacturing technologies to enhance production efficiency and reduce costs, thereby providing a stable supply amid market fluctuations and improving overall competitiveness.
3. Seizing Market Growth Opportunities and Accelerating Technology Development and Deployment
   The global semiconductor and electronics markets are increasingly influenced by generative AI, electric vehicles, and the expansion of data centers. This trend is driving a surge in demand for high-performance computing and advanced materials for high-frequency, high-speed transmission. Our company is committed to enhancing our material technology development for applications such as AI computing chips, high-voltage fast-charging systems for electric vehicles, and broadband communications. In parallel, we will boost our presence and marketing efforts in the Asian and North American markets to better serve the needs of our global customers.
4. Advancing ESG Corporate Culture and Promoting Green Manufacturing and Low- Carbon Supply Chains
   As the global emphasis on environmental protection and sustainable operations intensifies, our company will continue to promote green manufacturing processes, adopt low- carbon production methods, and enhance supply chain management to ensure eco- friendly standards throughout the entire value chain, from raw materials to finished products. These efforts will enhance our sustainable competitiveness as an enterprise.

（II）Key Production and Sales Policy

1. Accurately analyzing market changes to improve market responsiveness
   When facing the restructuring of the global electronics industry’s supply chain and regional development trends, the Company will enhance its market data analysis, remain updated on demand changes, adjust product portfolios and sales strategies, and ensure growth momentum in its key markets.
2. Enhancing high-frequency and high-speed material technologies to improve market penetration
   To meet the demand for high-speed computing and low power consumption, the Company will continually develop materials with ultra-low loss and high heat resistance, increase market share in the high-efficiency electronic products sector, and strengthen cooperation with major global customers.
3. Deepening technical cooperation with key global customers to establish long-term competitive advantages
   With the technological advancements in high-speed computing, electric vehicles, and the communications market, the Company will engage in forward-looking technical cooperation with major global customers, securing long-term, stable market orders and demand for mass production through joint development and the establishment of technical barriers.
4. Satisfying the emerging demand for electronic applications to improve brand competitiveness
   In addition to the existing advanced electronic materials market, the Company will further expand its business into emerging application fields, aiming to solidify its future market competitive advantages and ensure stable growth.

III、Future Development Strategies of the Company

(I) Continuously focus on developing AI servers, 5G infrastructure, and networking equipment, such as high-speed, high-frequency, low-dielectric constant, halogen-free materials, while aggressively expanding the development of eco-friendly products for 5G infrastructure, data centers, and cloud equipment.

(II) Promote and expand the market share of high-density interconnect materials to embrace a new generation of applications with high specifications.

(III) Actively promote niche products such as automotive electronics materials, high-frequency materials, and high-voltage-resistant materials for applications in autonomous driving, vehicle connectivity, and high-voltage charging.

IV、Affected by External Competitive Environment, Regulatory Environment and Overall Business Environment

In 2025, the global economic and industrial environment remains highly uncertain amid multiple external factors. Inflationary pressures in major economies are gradually easing; however, divergences in the pace and magnitude of monetary policy adjustments persist, and market expectations regarding interest rate trends and funding costs remain uncertain. The U.S. economy remains relatively robust, supported by consumption and technology investment, while Europe faces limited recovery momentum in manufacturing demand. China’s economy continues to undergo structural adjustment, with overall growth moderating compared to previous periods, and domestic demand and certain industry momentum still in transition. Accordingly, the trend toward supply chain regionalization and risk diversification continues to intensify, while geopolitical and trade policy developments further increase uncertainty in the operating environment.

Looking ahead to 2026, monetary policy adjustments in major global economies are entering a later stage, and the dynamic environment is expected to become more stable. However, geopolitical risks, changes in trade policies, and cyclical fluctuations in end-market demand will continue to create uncertainty for business operations. As next-generation AI, high-performance computing, and automotive electronics continue to drive technological advancements in advanced electronic materials, market competition will increasingly focus on technological capabilities, product quality, and supply stability. At the same time, regulatory requirements related to carbon management, supply chain transparency, and information disclosure continue to tighten, requiring companies to balance compliance with operational efficiency. In response to external competition and changes in the business environment, the Company will continue to strengthen R&D and optimize its product portfolio, enhance manufacturing resilience and supply chain flexibility, and deepen risk management and sustainable governance mechanisms to effectively respond to market fluctuations and enhance long-term competitiveness.